In this NIL technology, a thin resist film is firstly prepared onto a substrate by applying e.g. spin-coating. In a second step, a stamp with micro- or nanofeatures is pressed into the softened thermoplastic polymer, that is typically achieved by heating the material markedly above its glass transition temperature (Tg). After the cavities of the stamp have been filled with the NIL resist, the thin resist film is solidified again by means of a cooling below its Tg, so that the stamp can be removed from the imprinted NIL resist layer. Finally, the imprinted structures will mostly be transferred by plasma etching steps into the substrate.