Thinner / Diluents

An appropriate thinner can be applied to achieve a lower film thickness upon spin coating compared to the original resist solution.

Product

Resist series

ma-T 1045

mr-I PMMA, mr-NIL 6000E, mr-I 9000M, mr-NIL210

ma-T 1050

mr-I 7000R, mr-I 8000R, SIPOL, mr-XNIL26

mr-T 1070

mr-UVCur21, mr-NIL210, mr-UVCur26SF

 Adhesion Promoter / Primer

Some nanoimprint resists, particularly the Photo-NIL resist series, require an adhesion promoter, also called primer, to achieve a good substrate adhesion.

Product Resist series

mr-APS1

mr-UVCur21, mr-NIL210, mr-XNIL26

 Organic underlayer materials

UL1 is an organic transfer material that is typically applied in a bilayer system, i.e. in combination with a Si-containing NIL resist like the thermal NIL resist SIPOL. UL1 can be removed wet-chemically applying very mild process conditions for lift-off.

UL1 version UL1 layer thickness (@ 5000 rpm)

UL1-300nm

300nm

UL1-500nm

500nm

UL1-1000nm

1000nm