Dry film resists allow the easy manufacture of resist films in a broad variety of thicknesses. Dry film resists can be applied as single or multilayer coating on planar substrates or substrates with topographies. The advantage of dry film resists is the easy handling of dry resist layers of different thicknesses, eliminating waste and elaborate and time-consuming prebake processes to evaporate the solvent from very thick resist films applied in a spin-coating process. Manufacture of films in nearly every desired thickness, and the generation of almost any kind of different 2.5D structures in resist films piled upon each other is possible with considerably reduced processing time compared to the processing of solvent containing resist solutions.

Advantages:

• Easy handling and application of dry film resists, prebake step for solvent evaporation not required
• Material- and time-saving processing
• Application of low-cost table-top lamination tools possible
• Use of the resist structures in permanent applications (e.g. ADEX, SUEX of DJ Microlaminates) and in non-permanent applications (e.g. MX5000, WBR2000 of DuPont)
• Resist thickness tunable by multiple lamination

Process flow

Application examples:

• Non-permanent application: resist mould for electroplating, as etch mask, or as mould for stencil printing and reflow for solder bumping
• Manufacture of 2D and 2.5D micro patterns for permanent applications or as master for replication
• Tenting for manufacture of covered micro fluidic micro patterns, channels and devices
• Wafer Level Packaging
• Polymer MEMS
• Spacers

Associated products:

• ADEX
• SUEX
• MX5000
• WBR2000