Ink | InkEpo 5 mPas | InkEpo 8 mPas | InkEpo 12 mPas | InkEpo 25 mPas |
dyn. Viscosity [mPas]
(@ 25°C, 1000 s-1) |
5.0 | 8.0 | 12 | 25 |
Substrate preparation | Option 1: Dehydration bake at 200 °C for 5 min on a hotplate or for 30 min in an oven. Alternatively oxygen plasma can be applied. Option 2: Hydrophobic surface pre-treatment. |
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Ink-jet parameters | Piezo-actuated nozzle with a size of e.g. 30 μm, 50 μm or 70 μm Room temperature, up to 70 °C possible |
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Prebake | 80 - 90 °C | |||
Spectral Sensitivity | i-line - 365nm | |||
Exposure Dose
@ 365 nm UV mercury lamp (broadband exposure), UV-LED |
500 - 1.500 mJ/cm2 | |||
Post exposure bake (PEB) | 90 - 100 °C | |||
Hardbake | 100 - 140 °C (optional) | |||
Remover | mr-Rem 700 (NMP & NEP free)
mr-Rem 500 (NMP free) O2-Plasma |
Thinner | no thinner available |
Developer | not required |
Remover | mr-Rem 700 (NMP & NEP free)
mr-Rem 500 (NMP free) O2-plasma |