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ma-P 1200 series / ma-P 1275HV
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Unique Features

  • Film thickness up to 60 μm in one spin-coating step
  • Broadband-, g- and i-line exposure
  • High stability in acid and alkaline plating baths
  • High dry and wet etch resistance
  • Good thermal stability of the resist patterns attainable
  • Aqueous alkaline development
  • Side wall angle up to 87° with mask aligner broadband exposure
  • Suitable for pattern reflow

Applications

  • Etch mask - metals and semiconductors
  • Mould for electroplating
  • Fabrication of micro optical components, e.g. micro lenses by pattern transfer from reflowed resist patterns
  • Mask for ion implantation
ma-P 1200 series and ma-P 1275 & ma-P 1275HV for microsystems technology and microelectronics
Positive Photoresist Series and Thick Film Photoresists for UV lithography
Resist ma-P 1205 ma-P 1210 ma-P 1215 ma-P 1225 ma-P 1240 ma-P 1275 ma-P 1275HV
Film Thickness [µm]
spin coating @ 3000 rpm		 0.5 1.0 1.5 2.5 4.0 7.5

(up to 40 µm at lower spin speed)

 11

(up to 50 µm at lower spin speeds)
dyn. Viscosity [mPas]

(@ 25 °C, 1000 s-1)

 5 12 22 50 125 460 1100
Prebake 100 - 105°C
Spectral Sensitivity 350 - 450nm

i-line - 365 nm; h-line - 405 nm; g-line 436 nm
Exposure Dose

Hg lamp @ 365 nm

UV-LED monochromatic

 35 - 4000 mJ/cm2      (0.5 - 50 µm film thickness)

1000 - 4000 mJ/cm2    (> 10 µm film thickness)
Developer mr-D 526/S (TMAH based) - for greyscale lithography

ma-D 331 (NaOH based) - for standard binary lithography
Remover mr-Rem 700 (NMP & NEP free)

mr-Rem 500 (NMP free)

ma-R 404/S (strongly alkaline)
Recommended process chemicals:
Thinner ma-T 1050
Developer mr-D 526/S (TMAH based)
ma-D 331 (NaOH based)
Remover mr-Rem 700 (NMP & NEP free)
mr-Rem 500 (NMP free)
ma-R 404/S (strongly alkaline)

quotation request

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Hybrid Polymers, Positive Photoresists
Read more...
Blog_microlensarrays_byReflow_and_moulding_Schuster_Klein_reflow_widget
Manufacturing Microlens Arrays by Reflow and UV Moulding
A cost-efficient method for the manufacturing of micro lens arrays is the reflow of patterned positive resists ma-P 1200G or ma-P 1200 and subsequent pattern transfer using OrmoStamp® or OrmoComp®.
Positive Photoresists
Hybrid Polymers
Thermal reflow
3D microstructures
Micro Optics
Wafer-level-optics
ma-P 1200 series / ma-P 1275HV
ma-P 1200G series
OrmoStamp
OrmoComp
23. Juni 2020
Hybrid Polymers, Positive Photoresists
Read more...
Blog_optical3Dpatterning_greyscale_Schuster_3d_patterning_process
Optical 3D patterning by greyscale lithography and UV moulding
An excellent method for the manufacturing of optical 3D structures is grayscale patterning of positive resist ma-P 1200G and subsequent pattern transfer by UV moulding using OrmoStamp® and OrmoComp®.
Positive Photoresists
Hybrid Polymers
Greyscale lithography
Micro Optics
Wafer-level-optics
Nanoimprint lithography (UV- or photo-NIL) for permanent application
ma-P 1200 series / ma-P 1275HV
OrmoStamp
OrmoComp
23. Juni 2020

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Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.

Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics
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Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy
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Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

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Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

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Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays
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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices
View all Negativ Photoresists
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